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Monday, October 12, 17:30–19:30, Room “C”
MICROSYSTEM TECHNOLOGY 2
Session MT2: Poster presentations
Chair:
V. Avramescu, Honeywell, Bucharest, Romania
N. Marin, IMT-Bucharest, Romania
MT2.1 |
ABOUT USING COMBINED STRESSES FOR RELIABILITY TESTING OF MICROSYSTEMS, M. Bazu, L. Galateanu, V. Ilian, IMT-Bucharest, Romania. |
MT2.2 |
SILICON CANTILEVER BEAM MICRO-MACHINING AND STRUCTURE GEOMETRY CHARACTERIZATION, G. Ionascu, E. Manea*, C.D. Comeaga, N. Alexandrescu, I. Cernica*, L. Bogatu, “Politehnica” Univ. of Bucharest, *IMT-Bucharest, Romania. |
MT2.3 |
RELIABLE ELECTRICAL INTERCONNECTION FOR FLUIDIC GLASS BIO-CHIP TO MACRO WORLD, N. Dumbravescu, IMT-Bucharest, Romania. |
MT2.4 |
PHOTORESIST FILMS PATTERNING AT 355nm, V. Damian, I. Apostol, R. Muller*, L. Eftime*, INFLPR, Bucharest, *IMT-Bucharest, Romania. |
MT2.5 |
CHARACTERIZATION OF DEFECTS GENERATED DURING REACTIVE ION ETCHING, M. Avram,
A. Avram, M. Purica, A.M. Popescu, C. Voitincu, IMT-Bucharest, Romania. |
MT2.6 |
REACTIVE ION ETCHING FOR PATTERNING HIGH ASPECT RATIO AND NANOSCALE FEATURES, M. Avram, A. Avram, F. Comanescu,
A.M. Popescu, C. Voitincu, IMT-Bucharest, Romania. |
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