Wednesday, October 19, 9:00, Room “B”
MICROSYSTEM TECHNOLOGY 1
Session MT1: Oral presentations
Chair: F. Giacomozzi, FBK-irst Trento, Italy
M. Bodea, “Politehnica” University of Bucharest, Romania
MT1.1
9:00 |
INNOVATIVE ELECTRON AND ION BEAM LITHOGRAPHY WRITING STRATEGIES WITHOUT STITCHING ERRORS,D. Bruggemann,
J. Klingfus*, J. Sanabia*, M. Aktary*,
K. Burcham*, G. Piaszenski, Raith GmbH, Dortmund, Germany, *Raith USA, Inc., NY, USA. |
MT1.2
9:20 |
OXFORD INSTRUMENTS PLASMA TECHNOLOGY–YOUR BEST PARTNER FOR PLASMA PROCESSING,J. Hoche, Oxford Instruments GmbH Plasma Technology, Wiesbaden, Germany. |
MT1.3
9:40 |
CMOS-COMPATIBLE ALIGNED FUSION WAFER BONDING, V. Dragoi, G. Mittendorfer,
C. Flotgen, D. Dussault*, T. Wagenleitner, EV Group, St. Florian/Inn, Austria, *Product Systems Inc., Campbell, CA, USA. |
MT1.4
10:00 |
MEGASONIC-ENHANCED DEVELOPMENT FOR PHOTOLITHOGRAPHY YIELD IMPROVEMENT, D. Dussault, V. Dragoi*, Product Systems Inc., CA, USA, *EV Group, St. Florian/Inn, Austria. |
MT1.5
10:20 |
PMN-PT PIEZOELECTRIC MATERIAL AND RELATED APPLICATIONS IN SILICON-INTEGRATED DEVICES LIKE MICROACTUATORS AND ENERGY HARVESTERS, I.A. Ivan, J. Agnus*, M. Rakotondrabe*, P. Lutz*,
N. Chaillet*, “Valahia” University of Targoviste, Romania, *FEMTO-ST Institute, Besancon, France. |
11:00–11:30 COFFEE BREAK
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