Wednesday, October 19, 11:30, Room “B”
MICROSYSTEM TECHNOLOGY 2
Session MT2: Oral presentations
Chair: A. Dinescu, IMT-Bucharest, Romania
C. Ravariu, “Politehnica” University of Bucharest, Romania
MT2. 1
11:30 |
A FLEXIBLE TECHNOLOGY PLATFORM FOR THE FABRICATION OF RF-MEMS DEVICES, F. Giacomozzi, V. Mulloni, S. Colpo, J. Iannacci, B. Margesin, A. Faes, FBK-irst, Trento, Italy. |
MT2. 2
11:50 |
DISPERSION OF THE CASTING REPLICATION PROCESS FOR MICROFLUIDIC STRUCTURES, I. Stanciu, P. Obreja, R. Muller, D. Dascalu, IMT-Bucharest, Romania. |
MT2. 3
12:10 |
FABRICATION OF THROUGH-WAFER INTERCONNECTIONS BY GOLD ELECTROPLATING, D. Vasilache, S. Colpo, F. Giacomozzi,
B. Margesin, M. Chiste, FBK-irst Trento, Italy. |
MT2. 4
12:30 |
SiO2-METAL CANTILEVER STRUCTURES UNDER THERMAL AND INTRINSIC STRESS, C. Tibeica, V. Damian*, R. Muller, IMT-Bucharest, *National Institute for Laser, Plasma and Radiation Physics, Bucharest, Romania. |
13:30–14:30 LUNCH
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