Tuesday, October 18, 9:00, Room “A”
POWER DEVICES
Session PD: Oral presentations
Chair: M. Bazu, IMT-Bucharest, Romania
M. Brezeanu, Honeywell Romania SRL, Bucharest, Romania
PD. 1
9:00 |
COSMIC RAY IMMUNITY OF NEW IGBT STRUCTURES FOR AEROSPACE APPLICATION, M. Zerarka1,2, P. Austin1,2, M. Bafleur1,2, 1CNRS-LAAS, Toulouse, 2University de Toulouse, France. |
PD. 2
9:20 |
INTEGRATED AVALANCHE DIODE FOR 600V TRENCH IGBT OVER-VOLTAGE PROTECTION, A.P.-S. Hsieh, F. Udrea, W.-C. Lin*, University of Cambridge, UK, *Sinopower Semiconductor, Inc, Taiwan. |
PD. 3
9:40 |
DESIGN AND OPTIMIZATION OF A 250 nm SOI LDMOSFET, G. Camuso1, F. Udrea1, E. Napoli2, X. Luo3, 1 University of Cambridge, UK, 2University of Napoli Federico II, Naples, Italy, 3University of Electronic Science and Technology of China, Chengdu, P.R. China. |
PD. 4
10:00 |
COMPARISON BETWEEN MESA ISOLATION AND P+ IMPLANTATION ISOLATION FOR 4H-SiC MESFET TRANSISTORS, M. Alexandru, V. Banu, M. Vellvehi, P. Godignon, J. Millan, IMB-CNM, CSIC, Barcelona, Spain. |
PD. 5
10:20 |
THE SMALL SIGNAL AMPLIFICATION OF THE GATED DIODE OPERATED IN BREAKDOWN REGIME, Al. Rusu, D. Dobrescu, M. Enachescu*, C. Burileanu, A. Rusu, “Politehnica” University of Bucharest, Romania, *Delft University of Technology, The Netherlands. |
PD. 6
10:40 |
TOWARDS FABRICATION OF VERTICAL SLIT FIELD EFFECT TRANSISTOR (VeSFET) AS NEW DEVICE FOR NANO-SCALE CMOS TECHNOLOGY L. Barbut, D. Bouvet, J.-M. Sallese, EPFL Lausanne, Switzerland. |
11:00–11:30 COFFEE BREAK
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