European Centre of Excellence in
Microwave, Millimetre Wave and Optical Devices, based on
Micro-Electro-Mechanical Systems for
Advanced Communication Systems and Sensors

ADVANCED  MICROWAVE  DEVICES & CIRCUITS

• PACKAGED SINGLE POLE DOUBLE THRU (SPDT) AND TRUE TIME DELAY LINES (TTDL) BASED ON RF MEMS SWITCHES, G. De Angelis1, A. Lucibello1, R. Marcelli1, S. Catoni1, A. Lanciano2, R. Buttiglione2, M. Dispenza2, F. Giacomozzi3, B. Margesin3, A. Maglione4, M. Erspan4, C. Combi5, 1CNR-IMM Roma, 2SELEX-SI, Roma, 3FBK-irst, Povo, 4OPTOI, Gardolo, 5ST Microelectronics, Milano, Italy
• MICROWAVE FILTERS WITH MULTIPLE CROSS-COUPLINGS AND MAXIMUM UMBER OF CONTROLLED ATTENUATION POLES, G. Lojewski, N. Militaru,
  M.G. Banciu*, ”Politehnica” Univ. of Bucharest, *National Inst. of R&D Materials Physics, Bucharest, Romania
• TECHNOLOGY AND TEST OF COPLANAR GROUNDED WAVE-GUIDES ON MICRO-MACHINED Si WAFERS, A. Lucibello1, G. De Angelis1, E. Proietti1,
  R. Marcelli1, G. Bartolucci1,2, 1CNR-IMM Roma, 2Univ. of Roma “Tor Vergata”, Italy
• ON-WAFER EXPERIMENTAL CHARACTERIZA­TION FOR A 4-PORT CIRCUIT, USING A TWO-PORT VECTOR NETWORK ANALYZER, S. Simion1, G. Sajin1,
  R. Marcelli2, G. Bartolucci3, IMT-Bucharest, Romania, 2CNR–Inst. for Microelectronics and Microsystems, 3Univ. of Roma “Tor Vergata”, Roma, Italy