Facilitati experimentale ale IMT, relevante pentru executia proiectului TGE-PLAT
IMT dispune de facilitati tehnologice, de proiectare si testare pe care le pune la dispozitie partenerilor din cercetare, educatie, industrie. Incepand din anul 2009 acestea sunt accesate prin sistemul de „centru deschis” de micro- si nanofabricatie, mai precis IMT-MINAFAB (IMT centre for MIcro- and NAnoFABrication), primul de acest fel in estul Europei. Modul de accesare este descris pe pagina de web a acestui centru: www.imt.ro/MINAFAB.
Informatii despre infrastructura de cercetare a IMT si serviciile oferite pot fi obtinute si din baza de date ERRIS (www.erris.gov.ro).
- Facility for Micro-Nanostructuring of Devices and Systems (un grup de echipamente din IMT-MINAFAB care ofera facilitati unice in tara); http://erris.gov.ro/Micro-Nanostructuring
- IMT-MINAFAB, IMT Support Centre for Micro- and Nanofabrication (restul echipamentelor din facilitatea MINAFAB mentionata mai sus); http://erris.gov.ro/MINAFAB
- CENASIC, research Centre for Integrated Systems, Nanotechnologies and Carbon based nanomaterials (o facilitate inaugurata in decembrie 2015, cu servicii care vor fi integrate treptat in sistemul MINAFAB).
Firmele care solicita parteneriatul cu IMT pot accesa servicii oferite de aceste echipamente din infrastructura experimentala a IMT. Pentru domeniul CD abordat de proiectul TGE-PLAT, cele mai relevante echipamente sunt:
ECHIPAMENTE TEHNOLOGICE (in camere curate)
- Litografie optica (configurare 2D si 3D a fotopolimerilor) si fabricare masti fotolitografice
- Laser lithography system - DWL 66 fs, direct writing laser, high resolution pattern generator (Heidelberg Instruments Mikrotechnik, Germany)
- Double Side Mask Aligner - MA6/BA6 (Suss MicroTec, Germany)
- Nanolitografie- dimensiunea minima 20 nm si nanomanipulare.
- Electron beam lithography and nanoengineering workstation - e_Line (Raith, Germany )
- Dip Pen Nanolithography Writer - NSCRIPTOR (NanoInk, Inc., USA)
- Micro - Nanoprinting
- Inkjet printing – pentru printare cu diverse cerneluri (pe baza de polimeri conductivi, pe substrate rigide sau flexibile utilizand un pasttern predefinit;
- 3D Printer Selective Laser Sintering - EOS Formiga P100
- 3D Printer - Single Photon Photopolymerization MiniMultiLens system -EnvisionTEC
- Depuneri fizice- straturi metalice si oxizi metalici
- Electron Beam Evaporation and DC sputtering system AUTO 500 (BOC Edwards, UK);
- RF Sputtering- OXFORD INSTRUMENTS Gmbh
- Depuneri chimice - SiOxNy, Si3N4,SiNx, polisiliciu, SiO2, grafena, nanodiamant, compusi semiconductori AIIIBV
- PECVD - LPX-CVD, with LDS module (STS, UK);
- LPCVD - LC100 (AnnealSys, France)
- PECVD pentru grafena si nanodiamant- OXFORD INSTRUMENTS Gmbh;
- MBE- Molecular Beam Epitaxy (MBE) - COMPACT 21 DZ/Riber Inc./2015
- ALD- Atomic Layer Deposition (ALD) - OpAl / Oxford Instruments Plasma Technology, Ltd./2015
- Corodari uscate: DRIE, RIE
- System 100- ICP Deep Reactive Ion Etching System
- Procese termice
- Cuptor multiproces (oxidari, difuzii, tratamente termice)- Centrotherm, RTP
- Echipamente asamblare/incapsulare: Trasare plachete, Sudura structuri, fire Wafer bonding
- Bonder System
ECHIPAMENTE DE CARACTERIZARE
- Microscopie SEM;
- FEG-SEM - Nova NanoSEM 630 (FEI Company, USA)
- Microscopie de baleiaj SPM: AFM, STM, LFM, Phase Imaging, Force Modulation, Force Spectroscopy, SNOM, confocal, SECM
- Caracterizari nanomecanice
- Nanomechanical Characterization equipment - Nano Indenter G200 - (Agilent Technologies, USA)
- Difractometrie; Interferometrie; Spectroscopie; Voltametrie
- X-ray Diffraction System (triple axis rotating anode) - SmartLab - 9kW rotating anode, in-plane arm (Rigaku Corporation, Japan)
- spectroscopie Raman, FTIR , elipsometrie SE 800 XUV (SENTECH Instruments) ,
- High Resolution Raman Spectrometer - LabRAM HR 800 (HORIBA Jobin Yvon, Japan) cu modul TERS/AFM
- Echipamente caracterizari pe placheta si pe dispozitive incapsulate (dispozitive electronice, optoelectronice, optica integrata, senzori
- Microwave network analyzer (0.04-65 GHz) with Manual Probing Station - Lightning 37397D VNA/Anritsu; PM5/Suss MicroTec (Anritsu, Japan; Suss MicroTec, Germany)
- Wafer Probing Station - Easyprobe EP4 (Suss MicroTec, Germany)
- Semiconductor Characterization System (DC) with Wafer Probing Station - 4200-SCS/C/Keithley; Easyprobe EP6/ Suss MicroTec (Keithley Instruments, USA; Suss MicroTec, Germany)
- Set-up caracterizare componente optoelectronice si fotonice (masa optica, pozitioneri, surse de radiatie, monocromator, filttre, fibre optice)
- Criostate pentru caracterizari dispozitive nanoelectronice si fotonice la temperaturi scazute
- Echipamente de testari si fiabilitate
- Thermal shock chamber - TSE-11-A (Espec Europe, Germany)
- Free Fall Shock Machine - 0707-20 (MRAD, USA)
- Highly Accelerated Stress Test Chamber - temperature, humidity, pressure, polarization - EHS-211M (Espec Europe, Germany)
- Mobile Thermal Airstream System - ThermoStream TP04300A-8C3-11 (Temptronic, USA)
- Electrodynamic vibration system with thermal and electrical tests - TV 55240/LS (TIRA, Germany)
- Universal Ovens with electrical testing - UFB (Memmert, Germany); N6711A (N6741B,N6743B,N6746B,N6773A) (Agilent Tehchnologies, USA)
FACILITATI PENTRU ANALIZA, PROIECTARE SI SIMULARE, CAD
- Servere:
- Server Dual IBM 3750 cu 8 procesoare quad-core Intel Xeon MP 2.93 GHz, 196 GByte RAM si 1 TByte HDD + 876 GByte external storage;
- Server HPC cu 1 Nod management+9 Noduri de calcul cu 2 procesoare cu 12 core/procesor, 128 GB RAM fiecare, Infiniband FDR; Puterea de calcul efectiva 6.5 TFlops, Memoria RAM (totala sistem) 1472GB, Stocare 15 TB, coprocesor de tip Intel Xeon Phi
- Analize cuplate pentru MEMS/NEMS: COVENTOR, COMSOL 4.3, ANSYS Multiphysics 12.1, MATLAB 2015 si Simulink, SOLIDWORKS, MATHEMATICA 7, LABVIEW-Profesional
- Componente fotonice: simulare, modelare, proiectare (versiuni 2015)
- Opti FDTD 12.2.1, OptiBPM 12.0. Opti-HS, , OptiGrating (Optiwave, Canada)
- Circuite si microsisteme in unde milimetrice si micrometrice: proiectare si modelare
- IE3D, FIDELITY (Zeland, USA), CST, Microwave Office.