Cosmin Moisa
Head of R&D Advanced Projects, Software and Central Technologies Timisoara, Continental Automotive România
He studied between 1999 - 2006 Electrical Engineering at Politehnica University of Timisoara with a diploma stage with a 6-month contract at the "Fraunhofer Institute for Manufacturing Engineering and Automation" IPA in Stuttgart, Germany. In 2005, he started as Hardware Engineer at Siemens VDO, Timisoara. Since 2010, he joined the Interconnection Techniques in Electronics (TIE) contest as General Industrial Co-Chair and the IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) as Conference Co-Chair. In 2011, he started as Head of Department for Hardware and System Engineering. Between 2012 - 2019 he was Associated Lecturer and coordinator for the external class Development of Electronic Products. Between 2015-2022, he was heading the Product Development Center, Camera and Interior Sensing Timisoara. In 2020, he co-organized and hosted the kick-off for the IEEE Hungary & Romania EPS & NTC Joint Chapter. He started in 2021 as IEEE Romania Section Industry Ambassador. He was nominated in 2021 as the Secretary of the Working Group Microelectronics under the Aegis of the Romanian Academy.