SMARTPOWER

The goal of SMARTPOWER is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules respectively into industrial power inverters and RF transmitters systems. This main objective is supported in the project by two routes of research:

• The developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules and integrated temperature sensor.
• The development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner