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L8: Ambiental Technolgies Laboratory

Head of the Laboratory: Dr. Ileana Cernica

Interest in specific objectives and FP7 calls

• FP7-2010-NMP-ENV-ENERGY-ICT-EeB EeB.NMP.2010-1 New nanotechnology based high performance insulation systems for energy efficiency;
• FP7- ICT -2009-5 Challenge 3: Components,systems, engineering;
• FP7-ICT-2009-5 Objective ICT-2009.3.9: Microsystems and Smart Miniaturised Systems. Target outcomes: a) Heterogeneous Integration;
• FP7-NMP-2010-EU-Mexico NMP.2010.1.2-4 Adding Value to mining at the Nanostructure level;
• FP7-NMP-2010-SMALL-4, NMP.2010.1.2-2 Substitution of materials or components utilising "green nanotechnology";
• FP7-NMP-2010-CSA-4,NMP.2010.4.0-5 Support to coordination activities of NMP related European Technology Platforms, CA;

Main areas of expertise:

• Development of new technologies in the areas of Microsystems technologies: technological design and technological development up to the prototype level;
• New materials development (i.e. nanocomposites) focused on ambiental technologies applications
• New assembly techniques for Microsystems focused on traditional technologies applications
• Technological services:
  • technological assistance and consultancy (technological flows design, control gates,technological compatibilities)
  • defect analysis on technological flow
  • technological compatibilities for M(O)EMS integrated using CMOS technology
• Characterization services: FTIR and UV-VIS

Service examples

- New technology for microbiosensors for real time detecting and monitoring tuberculosis

• Development a differential SAW piezoelectric microsensor with a lay-out designed to increase sensitivity and selectivity;
• Processing of the tantalate and langasite substrates
• Microsensors assembly using reusable support

Sensor for detection of TB on langasite substrate	Type of connectors proposed for sensors

- New materials and micro/nanosensors technologies development

• Advanced nanocomposites materials used in  civil construction with antibacterial properties for ambiental improvement: To develope a new construction material, a “smart wall”, from composites cement- wood. Thin polymeric composites films with oxide nanopowders content (having antibacterial, antistatic tailored proprieties) and solar concentrators were applied.

Cement-wood composite substrate	Polymeric films with doped nanopowder

• Wood- polymer composite with components of nanostructured materials and nanosensors for improvement of indoor environment: We develp a complex structure (walls and sensors) that could be used in construction of safety and confortable indoor microclimate(i.e. wall resistance, easy structure, high mechanical resistance), monitoring temperature, humidity, contamination with bacteria's and fungies.
• Nanomaterials dedicated to ligno-cellulose composite used in furniture industry finishing processes: We develop new technologies for ligno-cellulose composites finishing, by totally replacing the organic solvents with nanomaterials with controlled properties in order to obtain hydrophobe surfaces and a high scratch resistance

Optical images of lignocellulosic composites substrates: a) lacquer with alumina nanoparticles; b) lacquer with indium tin oxide nanoparticles

- New MCM packaging technique for PIN microdetectors matrix with improved technological processes for optimized performances in transmission and direct coupling to the optical cable.

Characteristics:

• a silicon wafer used for PIN detectors assembly
• optimized 2 masks technology
• two steps anisotropic silicon etching for lowering the roughtness
• a 50 μm thick bronze-beryllium support used as ground palne for the micromatrix and also for configure the external pin connection of the micromatrix

 

- Process failure analisys:

In a pressure microsensor technology a three multilayer thin film deposition of SiO2 from TEOS by sol-gel method was used as final protection thin film. The process failed due to the inadequate treatment between the deposition of the second and the third film- the multilayer film is not functional as protection layer and the device failed electrically too (over sintering time).

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Last update: August, 2009