Processing equipments
|
|
|
Mask fabrication and lithography tools |
|
 |
Laser lithography system - DWL 66 fs, direct writing laser, high resolution pattern generator (Heidelberg Instruments Mikrotechnik, Germany); [...more details] |
 |
Double Side Mask Aligner - MA6/BA6 (Suss MicroTec, Germany) for optical lithography (DUV, UV), nanoimprint lithography (NIL-UV) [...more details] |
 |
Electron Beam Lithography and nanoengineering workstation - e_Line (Raith, Germany ) [ ...more details] |
 |
Dip Pen Nanolithography Writer - NSCRIPTOR (NanoInk, Inc., USA) [...more details] |
|
|
|
|
|
|
Physical deposition tools |
 |
Electron Beam Evaporation an DC sputtering system - AUTO 500 (BOC Edwards, UK) [...more details] |
 |
Electron Beam Evaporation system - EVD 500A (Neva, Japan) [...more details] |
 |
Vacuum coating system, boat evaporation - BAK-500 (Balzers, Switzerland) [...more details] |
|
|
|
|
|
|
|
|
Chemical deposition tools |
|
 |
PECVD - LPX-CVD, with LDS module (STS, UK) - to be installed soon [...more details] |
 |
LPCVD - LC100 (AnnealSys, France)- to be installed soon; [...more details] |
 |
APCVD - PYROX (Tempress, UK) - to be installed soon [...more details] |
|
|
|
|
|
Dry etching tools |
|
 |
RIE Plasma Etcher - Etchlab 200 (SENTECH Instruments, Germany) [...more details] |
 |
DRIE- Plasmalab System 100- ICP Deep Reactive Ion Etching System [...more details] |
|
|
|
|
|
Thermal processing tools |
|
 |
Furnace - oxidation, diffusion, sintering (Lindberg) [...more details] |
 |
Furnace - rapid thermal processing/annealing - AS-One (AnnealSys, France) [...more details] |
|
|
|
|
|
Microarrays, Biomolecule research |
|
 |
Micro-Nano Plotter - OmniGrid (Genomic Solutions Ltd., UK) [...more details] |
 |
Microarray Scanner - GeneTAC UC4 (Genomic Solutions Ltd., UK) [..more details] |
 |
Zeta Potential and Submicron Particle Size Analyzer - DelsaNano (Beckman Coulter, USA) [...more details] |
|
|
|
|
|
Wetbenches, Glove-box |
|
 |
Glove box for preparation and deposition of nanocomposites and organic layers under N2 athnosphere(Salare, USA) |
 |
Masks processes: resist development, Cr etching, resist removal, DI cleaning (Atechim, Romania) [...more details] |
|
|
|
|
|
Other tools |
|
 |
Die Bonding System |
 |
Wire Bonding System |
 |
Wafer Bonder System- SB6L-
Wafer - Substrate Bonder System [...more details] |
|
|
HOME |
 |
Last update: February, 2012 |
|