Conference Topics

Papers are solicited in the following areas:

Design and simulation tools
Fabrication, processes and materials
Packaging, assembling, 3D integration
Components and circuits
Antennas
MEMS and IC integration
RFIC/mm-wave circuit design
THz and sub-THz circuits and applications
Graphene and nanostructures for RF
Reliability and testing
RF-MEMS for space applications
Applications and system design