CENASIC is a newly developed R&D infrastructure, in operation since Oct. 2015. The new research center at IMT Bucharest includes a 200sqm, class 1000/100 (ISO 6/5) clean room fully equipped, with a dedicated 42sqm chemistry zone of class 1000/100 (ISO 6/5). The center is organized in eight labs, out of which four are dedicated to material growth, processing and analysis: Processing of carbon based nanomaterials and nanostructures, Graphene technology, Thermal Processes, Thin layer spectrometry. This 6 Meuro investment dedicated to processing and integration of carbon allotropes is already seamlessly integrated in the general IMT-MINAFAB facility, exploiting the entire technology flow available at IMT and making use of the advanced expertise accumulated by the operating personnel.
Domains of activity: Micro and Nanotechnology Facilities; Materials Synthesis or Testing Facilities
Facility for micro-nanostructuring of devices and sytems contain the equipments listed as follows:
Equipment for: Micro Lithography and custom configurations; Nanolitographiy; Special deposition technique; Physical deposition method (from solid pahse); Dry etching; Chemistry and Mask shop.
Laser lithography system - DWL 66 fs (Heidelberg Instruments Mikrotechnik, Germany), equipment that use laser direct writing process on resist for geometries transfer form computer to crom masks. The dimentions of masks produced by DWL equipment can be in rage of 4” – 6” and mimim resolution of line is 0,6 microns.
Electron Beam Lithography and nanoengineering workstation - e_Line-Raith GmbH, Germany; resolution line 10nm;
Double Side Mask Aligner - MA6/BA6-Suss MicroTec, Germany, resolution line 0.6 microns;
Electron Beam Evaporation - TEMESCAL FC-2000 (Temescal, USA), metalic thin laers deposition for transfering the mask geometris on substrate followed by lift-off.
Deep Reactive Ion Etching System (DRIE) , plasma ething equipment for silicon, SiO2, Si3N4.
Reactive Ion Eatching (RIE), plasma ething equipment for polisilicon, resist.
Main categories of servicies offered: technological services for micro-nano devices and systems: micro and nano-litography, 3D micro and nano-structuring in semiconductor materials; metalic layers for lift-off; plasma etching; custom masks design and realization.
Access mode: direct access or access through services for local (Romanian) and foreign users.
Quality certification of services: starting with June 2011 IMT-MINAFAB infrastructure which include Facility for micro-nanostructuration of devices and sytems is SR EN ISO 9001:2008 certified by TÜV Thüringen e.V. Germany.
