A class 10,000 clean room (105 sqm) for CVD thin layer deposition, RIE and DRIE and thermal furnaces processes (RTP):

High temperature furnaces processes:

• RTP (Rapid Thermal Processing Furnace)
• High temperature furnace (Carbolite)

Packaging equipment:

• Dicing Machines For Silicium Plates (3M225 - Russia)  with 2,3 and 4 inches, performing assignment of silicon, Si, glass substrates in chips, with diamonded dishes with thickness of 25 and 40 µm, until of maximum depth of 600 µm;
• Solding Thermosonic Machine With Gold Fibre (ASM – USA): it execute operations for soldering of gold fiber of φ= 25 - 35 µm on chips at temperature of     150 - 250°C, at a frequency of 50-60 KHz;
• Solding Ultrasounds Machine With Conexions Aluminium Fibre (US DRATHBBONDER MDB-11-Germ): it execute operations for solder of aluminum fiber of diameter φ= 25 µm on chips, at temperature of ambiance medium, at a frequency of 50-60 kHz.

Characterisation equipments - Spectrometric characterisation:

• FTIR Spectrometer (Tensor 27, Bruker Opticks)
• UV-Vis Spectrometer (AvaSpec-2048 TEC, Avantes)